摘要
接插件端子连续选择性镀金工艺技术的发展趋势,主要是围绕提高镀金层技术质量,降低镀金成本。介绍了在端子镀金前处理工序中,增加化学抛光或电化学抛光以及预镀工艺等,提高端子基材表面光亮度,来改善镀金层的外观质量。开发新的镀金中间阻挡层和应用中间阻挡层组合工艺技术,减少镀金中间阻挡层孔隙,提高阻挡层致密性.防止铜合金基材金属扩散迁移到镀金层表面。介绍了镀金新添加剂应用,如防沉积(置换)的微酸性镀金、自封孔的微酸性镀金、钴合金镀金工艺等。应用防变色保护剂降低镀金层厚度。介绍了应用环保新材料丙尔金替代有毒氰化亚金钾镀金工艺。
The development of continuous selective gold plating technology for connectors is focused on the improvement of gold layer quality and reducing of production cost.In the pretrearment process,the application of chemical or electrochemical polishing and pre-plating techniques could enhance the brightness and the appearance of connector surface.Meanwhile,new-style barrier layer and combined different barrier layers could reduce the pore density,and then increase the density of barrier layer so as to prevent the diffusion between substrate and gold layer.Finally the addition of new additives,discoloration protective agents and environment-friendly material-gold potassium citrate instead of toxic gold potassium cyanide in gold-plating techniques were introduced.
出处
《电镀与精饰》
CAS
北大核心
2011年第9期17-20,共4页
Plating & Finishing
关键词
镀金前处理
阻挡层
镀金新添加剂
接插件端子
选择性镀金
pretreatment for gold-plating
barrier layer
new additive for gold-plating
connector
selective gold plating
