摘要
随着科学技术的发展,晶体的力学性质,如弹性、脆性、硬度和解理性等引起了人们的重视。晶体材料应力分布取决于很多复杂因素(加热、退火、提拉、切割、搬运以及生长过程中的各种力学因素)。从应力表征、硬度及断裂韧性的测试方法入手,回顾并总结了晶体材料力学参数的表征手段,阐述了晶体开裂的分布规律及原因。其中光测方法(主要包括光弹法、X射线衍射法等)因其对晶体材料无任何机械损伤、检验灵敏度高而应用广泛:光弹性是光学晶体材料的重要特性,利用光弹仪测定光程差,根据平面光弹性的应力-光学定律确定主应力差;X射线衍射方法测定样品中宏观应力具有无污染、测量精度高等特点。压痕实验和划痕实验是表征晶体硬度的主要手段,结合化学腐蚀和光学观测方法可以有效探讨晶体开裂的微观机理。
Along with the development of technology, the mechanical properties of crystals, such as flexibility, brittleness, hardness, cleavability and so on, have been drawing peopleCs attention. The stress distribution of crystal materials depends on many complex factors such as heating, annealing, pulling, cutting, conveying and various mechanical factors in the growth process. The characterization of crystal materialsrmechanical parameters is reviewed and summarized,the distributing regulation and the reasons for crystal cracking are described, starting with the testing methods of elastic modulus, stress, hardness and fracture toughness. Optical measurement has been applied to a wide range for its high testing sensitivity and causing any mechanical damage in the crystal material. Both the indentation test and scratch test are the main methods to test crystal hardness.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2011年第15期1-3,14,共4页
Materials Reports
基金
自然科学基金资助项目(NSFC50721002)
关键词
晶体
应力
光弹
X射线衍射
压痕
开裂
crystal, stress, photoelasticity, X-ray diffraction, indentation, crack
