期刊文献+

Cu/Mo/Cu平面层状复合材料的研究进展 被引量:8

Research and development of Cu/Mo/Cu laminated composite material
在线阅读 下载PDF
导出
摘要 总结了Cu/Mo/Cu平面层状复合材料的特点和应用,通过平面层状结构设计,可以实现其在平面(x,y)方向更低的热膨胀系数和更高的热导率,其中热导率最高可达370W·m-1·K-1;介绍了其研究现状和制备方法,并通过对制备工艺的对比分析,指出热压复合和轧制复合是Cu/Mo/Cu层状复合材料生产工艺的发展趋势及方向。 The characteristics and application of Cu/Mo/Cu laminated composite material were summarized.By the plane and laminated design,lower thermal expansion coefficient and higher thermal conductivity in the plane(x,y) direction can be realized,wherein the maximum thermal conductivity is as high as 370W·m-1·K-1.The development and preparation methods were also introduced.By comparison of various methods,it is illustrated that rolling bonding and hot-pressing combination is the main tendency in preparing Cu/Mo/Cu laminated composite materials.
出处 《粉末冶金技术》 CAS CSCD 北大核心 2011年第3期218-223,共6页 Powder Metallurgy Technology
关键词 Cu/Mo/Cu 层状复合材料 轧制复合 Cu/Mo/Cu laminated composite material roll bonding
  • 相关文献

参考文献28

  • 1喻学斌,吴人洁,张国定.金属基电子封装复合材料的研究现状及发展[J].材料导报,1994,8(3):64-66. 被引量:57
  • 2Carl Zweben.Metal-matrix composites for electronic packing.JOM,1992,4(47):15-24.
  • 3刘正春,王志法,姜国圣.金属基电子封装材料进展[J].兵器材料科学与工程,2001,24(2):49-54. 被引量:73
  • 4胜利.高密度Mo-Cu合金的制备与组织性能研究.北京:北京有色金属研究总院,2009.
  • 5Luby S, Majkova E, Jergerl M, et al. Intermixing in immiscible molybdenum/copper muhilayered metallization under excimer laser irradiation. Applied Surface Science, 1996, 106 (2) : 243 - 246.
  • 6Ronald S F, Mentor, Ohio. Composite copper-molybdenum sheet:Richard D N, Chardon. Composite sheet made of molybdenum and dispersion-strengthened copper: United States Patent, 4957823. 1990 - 9 - 18.
  • 7Richard D N, Chardon. Composite sheet made of molybdenum and dispersion-strengthened copper: United States Patent, 4957823. 1990 - 9 - 18.
  • 8Cu-MoCu-Mo Laminates. http://www, plansee, com/molybdenum- cu-mocu-mo-laminates, htm.
  • 9Super CMC (Multi Layer Cu-Mo Clad Metal). http://www, fjcomposite, corn/11-cmc-e, html.
  • 10杨杨,李正华,程信林,朱筱北,裴大荣,高文柱.Cu/Mo/Cu爆炸复合界面组织特征[J].稀有金属材料与工程,2001,30(5):339-341. 被引量:10

二级参考文献56

共引文献348

同被引文献120

引证文献8

二级引证文献37

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部