摘要
本文介绍了聚酰亚胺的主要工艺性能和在专用IC中的应用,如表面钝化,多层布线层间介质和金属化剥离材料等。
The main process performance of polyimide and i1s applications, such as surface passivation, inter-layer dielectric in multilayer metallization, stripping material for metallization etc., is descibed in this paper.
出处
《微电子学》
CAS
CSCD
1990年第6期36-42,共7页
Microelectronics
