摘要
本文介绍了一种孔到线小间距、超高厚径比的PCB设计制作方法,此方法通过层压结构设计和对位精度设计,使厚径比能满足大部分厂家的工艺能力,同时孔到线的难点也在关键工序得以掌控。
This article introduced one kind of hole to line small,super-elevation thick diameter.Compared to the PCB design manufacture method,this method is through the lamination structural design and to the position precision design,which enables the thick diameter compared to satisfy the majority of factories craft ability,and simultaneously overcomes hole to line the difficulty and essential working procedure can be controlled.
出处
《印制电路信息》
2011年第4期195-199,共5页
Printed Circuit Information
关键词
高厚径比
结构设计
对位精度
High thick diameter ratio
hole to Line small
Structural design To position precision
