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无氰镀金工艺的研究 被引量:8

A Study of Non-cyanide Gold Electroplating
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摘要 传统的亚硫酸盐镀金液稳定性较差,就添加剂对镀液稳定性的影响进行了研究,并对镀层及镀液性能进行了测试。结果表明:镀层结晶细致,结合力、耐蚀性良好;镀液无毒、稳定性良好、分散能力和覆盖能力良好。新工艺有望取代氰化物镀金工艺,具有广阔的发展前景。 Since traditional sulfite gold plating electrolyte has the problem with bath stability,the effects of additives on bath stability were investigated,and the properties of the coating and bath were tested.The results show that the coating obtained by the new process has fine crystals,good adhesion and corrosion resistance;and the new gold plating bath,nontoxic and stable,has a good throwing power and covering power.The new process would likely substitute for cyanide gold plating process,and has a broad developing prospect.
出处 《电镀与环保》 CAS CSCD 北大核心 2011年第1期8-11,共4页 Electroplating & Pollution Control
关键词 无氰 镀金 添加剂 non-cyanide gold plating additive
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参考文献6

  • 1李东亮.银、金、铂的性质及应用[M].北京:高等教育出版社,1998.56-60.
  • 2陈全寿.再谈亚硫酸盐镀金[J].表面技术,1998,27(1):46-48. 被引量:8
  • 3张邦林.亚硫酸盐无氨镀金的工艺特性研究[J].涂装与电镀,2004(1):30-32. 被引量:1
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