期刊文献+

SiC单晶片CMP超精密加工技术现状与趋势 被引量:19

Situation and Development Trends of CMP for SiC Monocrystal Slice
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摘要 综述了半导体材料SiC抛光技术的发展,介绍了SiC单晶片CMP技术的研究现状,分析了CMP的原理和工艺参数对抛光的影响,指出了SiC单晶片CMP急待解决的技术和理论问题,并对其发展方向进行了展望。 The development of CMP technology for SiC single crystal is described.The progress and problems of CMP for SiC single crystal are reviewed in the paper,the theory of CMP for SiC single crystal and the influence of technical parameters are discussed,then the future prospect of CMP is outlined.
出处 《宇航材料工艺》 CAS CSCD 北大核心 2010年第1期9-13,共5页 Aerospace Materials & Technology
基金 陕西省重点实验室建设基金项目资助(09JS099)
关键词 SiC单晶片 化学机械抛光 粗糙度 抛光效率 SiC mono-crystal CMP Roughness Polishing efficiency
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参考文献25

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