摘要
目的:比较研究金-瓷、瓷-瓷2种结合界面微观形貌以及结合机制。方法:制作15mm×5mm×1mm金-瓷与瓷-瓷双层结构试样各1个,将以上2试样均从中一分为二,自凝塑料包埋,断面经高度打磨抛光并表面喷金,做扫描电子显微镜和能谱分析。结果:扫描电镜发现瓷-瓷界面较金-瓷界面结合更加紧密,无明显间隙。能谱分析显示金-瓷结合界面发生Cr、O、Si元素的扩散,瓷-瓷界面发生Si、Al、K元素的扩散。结论:金-瓷界面与瓷-瓷界面均能达到化学结合,瓷-瓷界面较金-瓷界面结合更紧密。
Objective：To compare the bond mechanism and microscopic structures between metal-ceramic and ceramic-ceramic interfaces.Methods：Specimens of alumina glass-infiltrated（15 mm×5 mm×1 mm）and cobalt-chromium alloy（15 mm×5 mm×1 mm）were fabricated,veneering porcelains were sintered on the specimen’s surface.Then the bilayered composites were fractured,invested and polished for scanning electron microscopy（SEM）and energy spectrum analysis.Results：Ceramic/ceramic interface showed tighter connection than metal-ceramic interface.Diffusion of Cr,O,Si across metal-ceramic interface and Si,Al,K across ceramic-ceramic interface were confirmed by energy spectrum analysis.Conclusion：Chemical bond is found between both metal-ceramic and ceramic-ceramic interface.The connection of ceramic-ceramic is smoother and tighter than metal-ceramic interface.
出处
《实用口腔医学杂志》
CAS
CSCD
北大核心
2010年第6期743-746,共4页
Journal of Practical Stomatology
基金
深圳市科技计划项目资助(编号:200903082)
关键词
全瓷材料
界面
结合强度
All ceramics
Interface
Bond strength
