摘要
本文采用作者提出的混合法（将光测技术与权函数相结合），求解了含孔板在不同应力场裂纹的应力强度因子。
The stress intensity factors of the plates with hdes under vdrious ledading wereobtained by the mixing methed (photo - technology in combination with weigh functionmethed) proposed by the writer.
出处
《沈阳航空工业学院学报》
1999年第2期13-18,共6页
Journal of Shenyang Institute of Aeronautical Engineering
关键词
含孔板
光测技术
权函数法
断裂力学
the plates with hole, photo-technology, the weight function method
