摘要
随3G通讯的持续推动,电路讯号传输迅速向高频(射频)类、高速(逻辑)类发展,传输信号稳定性要求骤增,而特性阻抗是解决信号完整性问题的核心所在。高精度特性阻抗控制的电路板体现了产品从设计到生产、测量的总体质量。本文详尽介绍了高速传输条件下为减小串扰(杂讯)的共面阻抗模块设计、新型微带线设计与理论计算分析以及与阻抗精度控制密切相关的计算软件选择、测试图形设计等工程资料处理实际问题;试验探索了特性阻抗各影响因素在不同设计中的关键影响程度及其对应的生产过程控制要点;论述了减少阻抗测试误差的相关测试技术与对策;希望能对PCB制造业同行有所帮助。
Demand for higher frequency or higher speed digital signal processing is notable today in the 3G（third generation） communication,which requires the PCB capable of maintaining the signal stable at high speed signal transmission condition.To meet this demand,the key is control precision for the characteristic impedance of PCB.This article is intended to introduce the coplanar structure and modified microstrip structure for reducing cross-talk（noise） and their theoretical analysis and calculation,relevant selection of software and layout of coupon;analyze various effect factor and countermeasure in the production process of PCB;discuss some testing technology and countermeasures to reduce the test error,and hope it will be helpful to PCB manufacturers.
出处
《印制电路信息》
2010年第11期34-39,70,共7页
Printed Circuit Information
关键词
特性阻抗
阻抗控制
工程设计
制程控制
测试技术
高速
Characteristic impedance
Impedance control
Engineering design
Process control
Testing techniques
High speed
