摘要
综述了影响薄膜附着力的因素，通过引入中间层，增强界面的附着力和减少应力来提高薄膜与衬底之间的结合强度。给出了一些采用中间层的例子。
The factors, which are responsible for the adhesion between films and substrates, are brieflyreviwed. The binding strength of films may be improved by inserting inerlayer to incerase the adhesion anddecrease the stress between them. A number of examples involving interlayer are given in this paper.
出处
《真空与低温》
1999年第2期70-76,共7页
Vacuum and Cryogenics
关键词
薄膜
中间层
附着力
界面应力
结合强度
thin films, interlayer, adhesion, stress of surface and interface
