摘要
分析了耐磨胶粘涂层基体与填充微粒间的微观热应力．结果表明，基体中热应力在相间界面达最大值；温差还可能导致基体屈服并导致界面脱粘．
In this paper, the thermal stress between the resinous basis and filled panical in anti-abrasion adhesion coating is analysed, the results show that in the interface the thermal stress reaches the maximum value, and it is possible that too high temperature causes the plasticity of resinous basis and separating between basis and filled particles.
出处
《力学与实践》
CSCD
北大核心
1999年第2期59-61,共3页
Mechanics in Engineering
基金
湖南省1997年度~1999年度攻关项目
关键词
胶粘涂层
相间应力
微观应力
热应力
涂层固化
adhesion coating, thermal stress between resinous basis and filled particles, micro-stress
