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用涂层压入仪测定薄膜与基体结合强度的探讨 被引量:7

Evaluation of Bonding Strength between Thin Film and Substrate by a New Indentation Tester
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摘要 用新颖的能连续加载、卸载并配有声发射监测的涂层压入仪 ,对薄膜与基体的结合强度进行了探讨。实验结果表明 ,膜或膜 /基破坏的声发射信号各有特点 ,可区分压入过程中 (含卸载 )开裂和剥落及其对应的载荷值。压入法的临界载荷 pc 为加载过程中使膜发生初始剥落的外载 ,用涂层压入仪可精确测定。 pc 值对基体硬度和表面粗糙度的变化敏感。故用涂层压入仪可以实现用压入法考察膜 The bonding strength between coating film and substrate is a most importante property for the evaluation of quality of coating.Newly developed indentation technique is capable of measuring such bonding strength.The indenter works in continuous loading and/or unloading mode with a monitor displaying the acoustic emission signal.The results showed that cracking and delamination of the film or the film/substrate interface in the indentation can be distinguished by acoustic signal analysis,and that the critical load corresponding to cracking and delamination can be measured accurately.The critical load, p c,which is sensitive to variations in the hardness and roughness of the substrate,was found to be the first delamination of the film.
出处 《真空科学与技术》 EI CAS CSCD 北大核心 1999年第2期89-96,共8页 Vacuum Science and Technology
基金 国家自然科学基金
关键词 压入法 涂层压入仪 涂层 结合强度 薄膜 基体 Indentation method,Coating indenter,Coating,Bonding strength
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