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激光切割加工过程中等离子体对焦点位置检测干扰研究 被引量:4

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摘要 在非接触式的激光切割焦点位置检测与控制系统中,切割加工中产生的等离子体对电容传感器产生干扰,从而导致焦点位置检测误差。本文根据电容原理定量地分析了等离子体对电容传感器干扰产生的误差,进而提出了消除等离子体于扰的措施。 In non-contact laser beam focus position detecting and control system, plasma cloud,which is induced by laser beam in cutting, will greatly interfere the capacitive transducer,thus result in focus position detecting error. Based on capacitive theory, this paper quantificationally analyzes the error,then bring forward means to avoid plasma's influence.
机构地区 华中理工大学
出处 《机械与电子》 1999年第3期33-35,共3页 Machinery & Electronics
基金 国家自然科学基金 国防科工委自然科学基金
关键词 激光切割加工 焦点位置 等离子体干扰 位置检测 Laser cutting Focus position Capacitive transducer Plasma's influence
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参考文献1

  • 1李科杰.传感器技术[M].北京:北京大学出版社,1985,2..

同被引文献19

  • 1董恩生,董永贵,吕文尔,贾惠波.同面多电极电容传感器的仿真与试验研究[J].机械工程学报,2006,42(2):6-11. 被引量:19
  • 2刘强.机械制造中的自动化激光加工技术[J].机械工业自动化,1991,(3).
  • 3Abels P.,Kratzsch C.,Schulz W., Universal coaxial process control system for laser material processing.,Proc.ICALEO99, vol87(section E):99-108,
  • 4Ingo Decker, Holger Heyn, Dirk Martinen et al, Process monitoring in laser beam cutting on its way to industrial application,SPIE,1997,Vol.3097:29-37.
  • 5H. Kaeberick, A. Jeromin, P. Mathew,Adaptive control for laser cutting using striation frequency analysis, Annals of the CIRP,1998, Vol.47:137-140.
  • 6R.Poprawe, Modelling,monitoring and control in high quality laser cutting, Annals of the CIRP, 2001, Vol.50 (1): 137-140.
  • 7P. Sheng, and Chryssolouris G., Investigation of acoustic sensing for laser machining processses: Laser grooving and cutting, Journal of Mater. Process. Technol. 1994,Vol. 43:145-163.
  • 8Hideyuki Horisawa, Masataka Tamura, Seiichiro Kimura, Plasma behaviors in laser cutting,2000,Proc. SPIE,Vol.4088:280-283
  • 9Hans K. Toenshoff, Andreas Ostendorf, Bernd Thiessen, Controlled CO2 laser cutting on the border to beginning of plasma,2001,Proc.SPIE,Vol.4276:80-89
  • 10Yuri T. Sukhov, I. V. Matiushin, Development of information-measuring channels of the monitoring system of quality cut for technological process laser cutting of materials,2001,Proc.SPIE,Vol.4157:88-92

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