摘要
高介电常数微波介质材料是实现现代微波通信器件要求的微型化、集成化发展趋势的重要材料,针对多层结构设计的器件要求,需要微波介质陶瓷能与高电导率电极实现低温共烧。本文综述了近年来高介电常数微波介质陶瓷及其低温烧结研究的最新进展,指出进一步提高陶瓷的介电常数和研究新型低温烧结助剂是今后发展的趋势。
High dielectric constant microwave dielectric ceramic（HDCMDC） is an important material for the demand of the miniaturization and integration of microwave communication devices.For the use in multilayer devices,microwave dielectric ceramics must be cofired with high conductivity electrode at low temperature.In this paper,the progress in investigation on HDCMDC and its low temperature sintering was reviewed,and further improving the dielectric constant of ceramics and developing new low temperature sintering aids were pointed out as the future tendencies.
出处
《中国陶瓷工业》
CAS
2010年第5期52-59,共8页
China Ceramic Industry
基金
江西省教育厅科技项目(编号:GJJ10562)
关键词
微波介质陶瓷
高介电常数
低温烧结
microwave dielectric ceramic
high dielectric constant
low-temperature sintering
