摘要
本文对环氧塑封料的性能特点、国内外发展趋势、我国在此领域研究开发现状和市场需求做了较详细的描述。
In this paper, the property characteristics and development trend of epoxy molding compound was introduced. The present situation of research, development and market requirement on epoxy molding compounds were also reviewed in detail.
出处
《精细与专用化学品》
CAS
1999年第10期11-12,共2页
Fine and Specialty Chemicals
关键词
环氧塑封料
市场
封装
现状
进展
集成电路
epoxy molding compound, research and de- velopment, market requirement
