摘要
对半导体制冷片进行了稳态传热分析,对半导体制冷风冷式散热片的底座厚度、翅片长度、翅片厚度、翅片数目、翅片顶端厚度等结构进行ANSYS模拟分析优化,并通过实验对比得出风冷式、水冷式散热的半导体制冷效率与传统压缩机制冷效率的区别;同时,通过改变风冷式散热半导体制冷的风扇功率、散热片结构等分析优化了半导体制冷的散热模式。
Steady-state heat transfer of semiconductor cooler was analysed.Air-cooled heat sink＇s structures such as its base＇s thickness,and its fin＇s length,thickness,number,and its fin＇s thickness to the top were simulated and analysed based on ANSYS.The differences among traditional compressor refrigeration＇s efficiency and the two ways＇ efficiency of air-cooled and water-cooled heat transfer of semiconductor refrigeration,were elicited through experiments.At the same time,with the change of fan＇s power and the structure of heat sink,modes of heat dissipation of semiconductor refrigeration were optimized.
出处
《低温与超导》
CAS
CSCD
北大核心
2010年第8期60-63,共4页
Cryogenics and Superconductivity
关键词
半导体制冷
强化传热
ANSYS
优化
Semiconductor refrigeration
Heat transfer
ANSYS
Optimize
