摘要
研究了在镍钴合金镀液中加入碳化钨微粒形成镍－钴－碳化钨复合镀层的共沉积过程。分析了镀液中碳化钨微粒的悬浮量、镀液温度及阴极电流密度对镀层中碳化钨含量的影响，并进一步通过正交试验优选出一种较佳的操作条件。通过扫描电镜对镀层形貌进行分析，结果发现，与镍钴合金相比，由于碳化钨粒子的加入，复合镀层晶粒细化。
Composite electrodeposits of nickel-cobalt-tungsten carbide were prepared by adding tungsten carbide particles in the nickel-cobalt alloy solution. The effect of suspended tungsten carbide particles, bath temperature and cathodic current densities on the content of tungsten carbide in the electrodeposits was studied, the preferred plating parameters were also optimized by orthogonal test.The morphology of obtained deposits were analyzed by means of scanning electronic microscopy. Compared with nickel-cobalt deposits,nickel-cobalt-tungsten carbide composite deposits have refined grain size and increased surface roughness.
出处
《电镀与涂饰》
CAS
CSCD
1999年第1期4-7,共4页
Electroplating & Finishing
基金
上海市高等学校科学技术发展基金
关键词
镍钴
碳化钨
电沉积
复合镀层
镀层
电镀
镀合金
nickel-cobalt-tungsten carbide,electrodeposition,composite coating
