摘要
利用Ｈ－８００透射电镜和Ｄｍａｘ／ｒｂ旋转阳极Ｘ－射线衍射仪分析了化学镀Ｃｏ－Ｎｉ－Ｐ三元合金薄膜的组织结构，并采用原子力显微镜观察了镀层的表面生长形貌，探讨了其生长机理。结果表明，随镀液中［Ｃｏ２＋］／［Ｃｏ２＋］＋［Ｎｉ２＋］的增大，镀层中Ｃｏ含量相应增加，Ｎｉ和Ｐ含量则下降。当Ｃｏ－Ｎｉ－Ｐ镀层中Ｐ含量小于５．０％时，镀层为晶态，且晶粒随着镀层的增厚而长大。随Ｎｉ和Ｐ含量的增高，镀层向非晶结构过渡；当Ｐ含量大于６．５％时，镀层经很薄的微晶过渡区后很快以非晶结构生长；当镀层含磷量处于５．０％～６．５％过渡区时，初期镀层为１２０ｎｍ左右的微晶，厚度增加时，晶粒尺寸迅速减小。
Abstract The sturcture and growth mechanism of electroless plated Co
Ni P film were studied by TEM,XRD and AFM. It was shown that with increasing of [Co 2+ ]/[Co 2+
]+[Ni 2+ ] in the bath, the Co content increased,and Ni and P content decreased in the film. The
more content of Ni and P in the film, the smaller the size of crystals would be. When the film
became thicker,the stucture of the film with P%>6.5% changed into amorphous state. When P in
the film lay in 5.0%￣6.5%,the film was composed of crystallites ￣ 120 nm in size.
出处
《材料保护》
CAS
CSCD
北大核心
1999年第3期1-4,共4页
Materials Protection
