摘要
阳极键合是一种利用电和热相互作用实现固体电解质玻璃(陶瓷)与金属材料固态连接的一种新方法。运用共阳极法实现多层玻璃/铝的键合,并采用微拉伸试验和MARC非线性有限元分析软件,分析了玻璃与铝多层键合试件冷却后,接头的力学性能和残余应力分布状况。试验发现,在玻璃/铝/玻璃多层连接区,键合界面附近的残余应力和应变呈对称分布,多层结构的对称性有利于缓解接头应变和应力,表明应用公共阳极法可实现多层玻璃/铝/玻璃的良好键合。
Anodic bonding is a new way to realize the bonding between solid electrolyte glasses（ceramics） and metals through the interaction process of electricity and heat.The bonding of multi-layer of glass and aluminum stack was achieved by the common anode bonding process.The mechanical property and the residual stress of the glass/aluminum/glass bonded wafers were analyzed by means of the micro-tension test and nonlinear finite element simulation with the software MARC.It is found that the microstructure and residual stress distribution are symmetrical in both sides of the aluminum interfaces.The symmetry of the multi-layer structure is beneficial to mechanical property of the joints.It indicates that the multi-layer glass/aluminum/glass wafers can be bonded firm due to the application of a common anode process.
出处
《机械工程与自动化》
2010年第3期99-101,共3页
Mechanical Engineering & Automation
基金
太原科技大学校青年基金项目(2007110)
关键词
阳极键合
多层
有限元分析
力学性能
anodic bonding
multi-layer
finite element analysis
mechanical property
