摘要
本文对近年来国外ＦＲ－４基板材料所用的环氧树脂在几个方面的技术进展作一探讨和综述。其中包括：（１）分子量分布的改进；（２）紫外光遮蔽性和自动光学检测技术；（３）绝缘可靠性；（４）适应环境保护要求的品种。
Technical development in some respects of the epoxy resin used for FR-4 basic board abroad, including: (l ) modifying the molecular-weight distribution; (2) UV-block and AOI (Automatic Optical inspection) technology; (3)insulating reliability; (4)the epoxy compound adapting the requirement of environmental protection,was reviewed in this paper.
出处
《热固性树脂》
CAS
CSCD
1999年第1期32-38,共7页
Thermosetting Resin
