摘要
综述了最近电路板用无卤阻燃环氧树脂材料研究开发的进展。主要从环氧树脂、固化剂及添加型阻燃剂三个方面对无卤阻燃环氧树脂材料的研究情况进行了介绍。重点介绍了新型的含磷、含氮、含硅和本征阻燃环氧树脂, 作为固化剂的芳香族缩聚磷酸酯、含磷多胺类化合物和改性酚醛树脂,以及磷系、镁-铝系和锑系添加型阻燃剂,并对其发展前景进行了展望。
An overview of the recent developments of halogen-free flame-retarded epoxy resin used in electronic circuit boards was presented, in which the epoxy resin, hardener, and flame retardam were involved. Novel epoxy resins include phosphorus, nitrogen, silicon containing intrinsic flame-retarded resins. Aromatic polyphosphates and polyamines, modified phenol resins, phosphorous, aluminum, magnesium, and antimony based compounds constituted the flame-retarding hardener and reagents. The prospect in this field is also discussed.
出处
《中国塑料》
CAS
CSCD
北大核心
2005年第12期1-6,共6页
China Plastics
基金
军工民口配套项目(MKPT04-388)
关键词
阻燃性
固化剂
阻燃剂
环氧树脂
flame-retardation
curing agent
flame retardant
epoxy resin
