期刊文献+

绿色镀膜用磁控溅射电源的设计与实现 被引量:5

The Design and Implementation of Magnetron Sputtering Power in Green Coating
在线阅读 下载PDF
导出
摘要 传统的化学电镀技术在生产过程中会产生大量的三废污染,而绿色镀膜技术可以很好地解决该问题。磁控溅射镀膜是绿色镀膜技术中的重要环节。针对大型绿色真空镀膜设备,介绍了一种大功率绿色镀膜用磁控溅射电源的设计方法,描述了电源控制算法,通过部分电路图和波形图介绍了主电路设计、开关管的并联和高频整流滤波电路等几个问题;同时给出了设计高频变压器的过程和方法。该电源已用于实际生产中,且运行效率高,工作可靠。 Conventional chemical plating technology in the production process emits a large amount of waste pollution,but the green coating has a good solution of this problem.Magnetron sputtering technology of the green coating is very impor-tant for Large green vacuum coating equipment.This paper introduces a high-power switching power supply by some circuit diagrams and waveforms.It introduces a few questions such as the design of the main circuit,the parallel of the switches and the circuit of the high-frequency rectifier.At the same time,the paper introduces the process and methods of the design of specific high-frequency transformer.The power supply is used in actual production and has high efficient of operation and works reliably.
出处 《电力电子技术》 CSCD 北大核心 2010年第4期66-68,共3页 Power Electronics
基金 2007年度国家重点新产品计划立项项目(2007GRG10004)~~
关键词 磁控溅射电源 绿色镀膜 滑模控制 高频变压器 magnetron sputtering power green coating sliding mode control high-frequency transformer
  • 相关文献

参考文献3

  • 1Abraham I Pressman.开关电源设计[M].北京:电子工业出版社,2005
  • 2Loche D,Barde H.Lithium-Ion Battery Cell Balancing in LEO[A].Proceedings of the Sixth European Space Power Conferenee[C].Porto Portugal:European Space Ageney,2002:507-512.
  • 3Kiewe B,Langenecker G.A Lithium-Ion Battery Charger With Cell Balancing[A].Proceedings of the Sixth European Space Power Conference[C].Porto Portugal:European Space Agency,2002:497-500.

共引文献11

同被引文献24

  • 1查申森,郑建勇,苏麟,吴恒荣,陈军.大功率IGBT并联运行时均流问题研究[J].电力自动化设备,2005,25(7):32-34. 被引量:25
  • 2杨文茂,刘艳文,徐禄祥,冷永祥,黄楠.溅射沉积技术的发展及其现状[J].真空科学与技术学报,2005,25(3):204-210. 被引量:46
  • 3T Kim.Internal Stress Dependence of Aluminum Doped Zinc Oxide Thin Films Deposited by DC magnetron Sputter on Deposition Conditions[J].Joumal of the Korean Physical Society, 2010,56( 3 ) : 805-808.
  • 4Anders, Andre.High Power Impulse Magnetron Sputtering and Related Discharges:Scalable Plasma Sources for Plasma-based Ion Implantation and Deposition[S].Lawrenee Berkeley National Laboratory,2010.
  • 5Kouznetsov V, Macak K, Schneider J Met al. A novel pulsed magnetron sputter technique utilizing very high target power densities [J]. Surface and Coatings Technology. 1999, 122(2): 290-293.
  • 6Helmersson U, Lattemann M, Bohlmark J et al. Ionizedphysical vapor deposition (IPVD): A review of technology and applications [J]. Thin Solid Films. 2006, 513(1-2): 1-24.
  • 7Boo J H, Jung M J, Park H K et al. High-rate deposition of copper thin films using newly designed high-power magnetron sputtering source [J]. Surface and Coatings Technology. 2004, 188: 721-727.
  • 8Anders A, Andersson J, Ehiasarian A. High power impulse magnetron sputtering: Current-voltage-time characteristics indicate the onset of sustained self-sputtering [J]. Journal of Applied Physics. 2007, 102(11): 113303.
  • 9刘胜利.现代高频开关电源实用技术[M].北京:电子工业出版社,2004.
  • 10Sterling Myers, Jianliang Lin, Roberto Martins Souza.The β to α Phase Transition of Tantalum Coatings Deposited by Modulated Pulsed Power Magnetron Sputtering [J]. Surface and Coatings Technology, 2013,21 (4) : 38-45.

引证文献5

二级引证文献18

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部