摘要
化学镀铜是指在由主盐硫酸铜、络合剂和添加剂组成的镀液中加入适量还原剂,在一定的反应条件下,将铜离子还原成铜并沉积在基材表面的1种工艺。本研究以杨木单板为基材,分别使用氯化钯乙醇溶液活化工艺、银氨溶液常温活化工艺和铜盐溶液活化工艺对基材活化后进行化学镀铜,分析和比较了三种活化工艺对镀层表面光亮性、均匀度和导电性的影响,总结出最优活化工艺。
The electroless copper plating liquor is composed of copper sulfate,potassium sodium tartrate,EDTA·2Na,additives and reducing agent,in this liquor copper ion will be reduced to copper and deposit on the surface of the substrate in appropriate reaction conditions.In this study,poplar veneer is selected to be the substrate.Three different activations are used to activate the substrate respectively and copper plating on the substrate is operated.They are the palladium chloride dissolved in ethanol,silver nitrate dissolved in ammonia on normal temperature and copper salts activated technics.Effects of three activated technics on brightness,uniformity and electrical conductivity of electroless copper plating are studied.Finally,the best activated technics is selected.
出处
《内蒙古农业大学学报（自然科学版）》
CAS
北大核心
2009年第3期155-159,共5页
Journal of Inner Mongolia Agricultural University(Natural Science Edition)
关键词
木材
活化工艺
化学镀铜
镀层性能
Wood
Activated method
Electroless Copper Plating
Properties of the layer
