摘要
在苯酚磺酸(PSA)镀锡液体系中,采用碘量法测定连续电镀过程中Sn4+的浓度,通过金相观察、电化学实验、孔隙率实验研究了在连续电镀过程中,不同Sn4+浓度电镀下镀层的表面形态和耐蚀性规律.结果表明,在Sn4+浓度为与结论相对应,改为2.9675～4.9874g/L时,镀层连续、光滑.随着Sn4+浓度的上升,镀层的孔隙率上升,耐蚀性降低.
In the p-hydroxybenzene sulfonic acid （PSA） system, the method of iodometry was used to determine the concentration of Sn^4＋ ions in the continuous electroplating process. The measurement, which consisted of metallographic microscope, electrochemical experiments and porosity, was used to characterize the surface configuration and corrosion resistance for the electroplating film. From the results, it was shown that the electroplating film was continuous and slippery when the concentration of Sn^4＋ ions was 2. 967 5g/L. With the Sn^4＋ concentration increasing, the porosity of coatings increases,and corrosion resistance decreases.
出处
《沈阳理工大学学报》
CAS
2009年第6期35-38,共4页
Journal of Shenyang Ligong University
关键词
PSA
四价锡
电镀
耐蚀性
PSA
tetravalent tin
electroplating
corrosion resistance
