摘要
环氧树脂的室温固化体系通常多采用脂肪胺类作固化剂。如乙二胺等。但其毒性一般较大，强度和耐热性偏低。本文研究了一种低毒室温固化体系。由环氧树脂的新型固化剂DDDM（3，3＇二乙基4，4＇二氨基二苯甲烷）和低分子聚酰胺、三乙醇胺及活性稀释剂U－45组成。该体系的毒性大大低于乙二胺体系，而力学性能却高于乙二胺体系。由于采用了活性稀释剂U－45，不仅改善了该体系的工艺性能，同时其强度也有提高。该体系可用于室温固化的玻璃钢、胶粘剂、浇铸料等领域。
The curing agent system for epoxy resins at room temperature was usually type of aliphatic amines such as ethylenediamine, which has disadvantages of poison, low strength and poor heat resistance. A new type of complex curing system with low toxicity for epoxy resins at room temperature was studied in this paper. It was made up of a new curing agent,3, 3'-diethyl-4, 4'-diaminodiphenylmethane (DDDM ), low-molecular polyamide, tri-ethanolamine and reactive diluent U-45' Its toxicity is much lower than that of ethylenedi-amine, but the mechanical properties of the resin cured from it were better than that from ethylenediamine. Addition of reactive diluent U-45 improved not only processabilities of sys-tem but also the strength. It can be applied to areas of glassfiber reinforced plastics, adhe-sives, and resin casts, cured at room temperature.
出处
《热固性树脂》
CAS
CSCD
1998年第3期16-21,共6页
Thermosetting Resin
