摘要
LED封装工艺过程中,芯片表面的氧化物及颗粒污染物会降低产品质量,如果在封装工艺过程中的点胶前、引线键合前及封装固化前进行等离子清洗,则可有效去除这些污染物。介绍了等离子清洗原理及清洗设备,并对清洗前后的效果做了对比。
In LED package process, oxide and particle contamination on chip surface can reduce quality, but RF plasma cleaning before dispensing,wire bonding or solidification could efficiently remove this contamination. This article introduces plasma cleaning theory and equipment, and compares the effect after cleaning with it before.
出处
《科技资讯》
2009年第31期56-58,共3页
Science & Technology Information
