摘要
提出了一种全新的亚微米级温度传感器的构想。作者在借鉴AFM悬臂测头的基础上，采用了微机械加工技术中的各向同性和各向异性腐蚀技术，在硅材料上完成了悬臂梁与硅尖制作。制成的梁的厚度在6μm左右、尖端曲径半径远小于1μm。随后对悬臂梁前端的硅尖进行尖端放电，隧穿其顶端的Si_3N_4层形成温敏器件──一个微型的热电偶。最后进行了这一温敏传感器的引线和封装。由于制作所形成的硅尖曲径半径在0．1μm左右，从而可以在其尖顶上形成亚微米级的温度传感器，在集成电路的探伤与修补以及生物技术领域，有着广阔的应用前景。
A new design of submicron St-tip sensor is presented in this paper.Using the construction of AFM for reference St-tips and cantilevers are constructedon Si substrate by microfabrication and IC fabrication techniques. The thickness ofcantilevers is about 6 μm and radius of tips is far less than 1 μm. By exerting voltagebetween the tip and substrate,the Si_3N_4 layer on the top of tips are broken throughto form a temperature sensor, a mini thermocouple. Finally, leads and potting ofthese sensors are designed. For the thermocouple is on the top of a tip and radius ofthe tip is no more than 30 nm,so the sensor can be widely used in the field of biology,medical science and IC crack detection and reparation.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
1998年第3期244-251,共8页
Research & Progress of SSE
