摘要
介绍一种新型的半导体刻蚀方法，这种干法刻蚀采用电子束微细加工进行试验和研究，从而体现出它的优越性和发展前景．
This essay is to introduce a new type of semi conductor etching method. It employs electronic beam fine processing to make experiment. The study reflects advantages and promising future on this dry etching technique.
