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三元共聚改性酚醛树脂的固化行为及性能 被引量:4

Curing Behaviors and Properties of Ternary Polymerization Modified Phenolic Resin
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摘要 以酚醛为基体,首先环氧豆油(ESO)与酚羟基接枝醚化,而后以剩余酚羟基为酚源引入苯并噁嗪环,合成了一种具有优异韧性和热稳定性的环氧大豆油、苯并噁嗪及酚醛三元共聚树脂(ESO-PA-PF)。采用FT-IR表征了改性树脂的分子结构;以差示扫描量热法(DSC)对改性树脂的固化行为进行了分析,并研究了其固化动力学特征,分析了聚合组分对树脂固化行为的影响机理;用热重分析法(TG)对树脂的热稳定性进行了分析;用扫描电镜(SEM)观察了改性酚醛树脂样品冲击断面的微观形貌。结果表明,改性树脂的热稳定性较酚醛树脂及环氧豆油改性酚醛树脂有很大程度提高。共聚改性树脂具有较高的冲击韧性及弯曲强度。微观形貌分析表明,环氧豆油低聚物形成橡胶相分散在树脂基体中,冲击断裂时形成空穴引起基体剪切屈服,阻止裂纹的进一步扩展,同时空穴吸收大量的变形或断裂的能量,大大提高了改性树脂的韧性。论文还对树脂的增韧机理进行了探讨。 The ternary polymerized phenolic resin modified by epoxidized soybean oil (ESO) and benzoxazine (PA), ESO-PA-PF, was synthesized in this study, and the molecular structure of the prepared modified resin was characterized by FT-IR method. The curing behaviors and curing kinetic characteristics of the prepared ESO-PA-PF were studied by non-isothermal differential scanning calorimetry (DSC); the reaction mechanism of modifier affecting on the curing behavior of the modified resin was also investigated. The thermogravimetric (TG) analysis method was used to characterize the thermal stability of the modified resin; the toughening mechanism was investigated, and the SEM was used to observe the micro morphology of the resin intersections formed by impaction. The results show that the modified resin has higher flexural strength and impact toughness, and the thermal stability of the ternary polymerization modified phenolic resin is much higher than those of the neat phenolic resin and the phenolic resin only modified by ESO. The SEM micrographs demonstrate that the ESO oligomer is dispersed in the matrix as rubber phase and forms cavity holes when the impact is loading; the formation of the cavity holes can induce shear yielding of the matrix and prohibit the further development of the crack.
出处 《高校化学工程学报》 EI CAS CSCD 北大核心 2009年第4期655-660,共6页 Journal of Chemical Engineering of Chinese Universities
基金 广东省关键领域重点突破项目(20050106)
关键词 酚醛树脂 环氧豆油 苯并噁嗪 三元共聚 韧性 耐热性 固化动力学 phenolic resin epoxidized soybean oil benzoxazine ternary polymerization thoughness thermal stability curing kinetics
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参考文献7

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