摘要
利用正交试验设计、可焊性测试仪测定润湿力的方法，探讨了电子元器件引线上６０焊锡镀层中的微量元素Ｂｉ和Ｓｂ及热浸镀温度对可焊性的影响。方差分析表明，Ｂｉ与Ｓｂ二元素的交互作用对焊锡润湿性能的影响高度显著；微量元素Ｂｉ对焊锡润湿性能影响显著。用正交多项式回归分析，得出了Ｂｉ和Ｓｂ的含量、热浸镀温度与焊锡可焊性间的关系式，用此关系式可对焊锡可焊性进行评价及预测。由试验还得到了Ｂｉ和Ｓｂ的含量及热浸镀温度的优化组合条件。
By using the orthogonal test design and measuring wetting power, the influences of trace elements Bi and Sb and the temperature of immersion plating on the solderability of 60 tin lead solder were studied, with the help of universal solderability test for the cladding of the lead of electronic components. By variance analysis, the results showed that the influence of the interaction between trace elements Bi and Sb on the wettability of solder is the much remarkable, and that of trace element Bi is marked. The relational formula between Bi and Sb contents, the temperature immersion plating and solderability was given, using the regressive analysis of orthogonal multinomial. It can be used to appraise and forecast the solderability of solder. The optimal combination has been found for the Bi, Sb contents and the temperature of immersion plating.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
1998年第A01期192-196,共5页
The Chinese Journal of Nonferrous Metals
关键词
微量元素
焊锡
可焊性
润湿性
焊接
trace element Bi and Sb solder solderability wettability
