摘要
采用无氧紫铜为基材,施镀条件为：pH=9.8±0.1,温度45-55℃,研究了化学镀钯工艺。结果表明,化学镀钯液优化组成为：3 g/L PdCl2,10-15 g/L NaH2PO2,160 mL/L NH4OH（28%）,40 g/L NH4Cl。镀液稳定性好、温度范围宽,易于施镀、便于维护。所得镀层均匀、平整、半光亮。
Using non-oxo copper as substrate, the condition of application plated is pH = 9.8 ＋ 0.1, temperature is 45 - 55℃. The process of chemical palladium plating was studied. The result showed that the optimization of component of chemical palladium-plating is PdCI is 3 g/L, NaH2PO2 is 10 - 15 g/L, NH4OH is 160 mL/L,NH4Cl is 40 g/L. The solution have good stability,wide range of temperature easy to application plating and maintenance, coating is uniform, half a bright.
出处
《应用化工》
CAS
CSCD
2009年第6期908-910,共3页
Applied Chemical Industry
关键词
化学镀
钯
镀层
沉积速率
稳定性
chemical plating
palladium
coating
deposition rate
solubility
