摘要
研究了不同晶粒度(2μm、4μm、7μm)TC21合金在温度880～920℃、压强1～2MPa和时间30～90min下的超塑性扩散连接。利用金相显微镜、电子探针分析了晶粒尺寸、温度对该合金超塑性扩散连接的影响。结果表明:TC21合金扩散连接过程中,元素沿晶界扩散,晶粒越细小,扩散效果越好,焊合率越高。晶粒度为2μm的TC21合金平均焊合率为99.5%;晶粒度为4μm的TC21合金平均焊合率为91.8%;晶粒度为7μm的TC21合金平均焊合率为88.7%。同时,β相稳定化元素在焊接接头处聚集,增加了接头处β相分布。
Superplastic diffusion bonding of TC21 alloy with different grain size （2μm, 4μm and 7μm） was investigated. The tests were carried out at temperature range 880-920℃, air pressure range 1-2MPa and time range 30-90min. The effects of grain size and temperature on superplastic diffusion bonding were studied by optical microscope and electron probe microanalyzer （EPMA）. The results indicate that the alloying elements diffuse through grain boundaries and the diffusion bonding of finer grain size TC21 alloy has much higher bonding rate. The average bonding rates of TC21 alloy about grain size 2μm, 4μm and 7μm are 99.5%, 91.8% and 88.7% respectively. Simultaneously, the stable element of β phase is collective at bonding joint.
出处
《航天制造技术》
2009年第3期8-13,共6页
Aerospace Manufacturing Technology
基金
教育部科学技术重点项目资助(106055)
关键词
TC21合金
超塑性扩散连接
扩散接头
TC21 alloy superplastic diffusion bonding diffusion bonding joint
