摘要
讨论了ＡｌＮ陶瓷金属化浆料的制备，在氢气氛中，可实现无氧铜与ＡｌＮ的复合，从室温到５００℃的变化下无剥离现象。
It is discussed that the preparation of metalizing AlN ceramics coating and the realizability of joining of Cu/AlN without fractrue of interefacial bond from normal temperature to 500 ℃.
出处
《电子工艺技术》
1998年第4期157-158,162,共3页
Electronics Process Technology
