摘要
采用电化学方法研究了添加剂对把电沉积层氢含量和内应力的影响。结果表明，含有光亮剂的镀液中所获得的钯电沉积层氢含量较无添加剂的显著提高，表面活性剂可极大降低镀层氢含量。添加剂的协同作用使镀层应力状态发生变化；在电沉积初期，沉积层内应力变化较大，随后逐渐趋于稳定。
The effect of additives on hydrogen content and internal stress of palladiumelectrodeposits was studied by electrochemical method. The results show that hydrogen contentof the obtained palladium electrodeposits from the bath with brighteners is obviously higherthan that without additives, and will be remarkably decreased in the bath with surfactant.Thesynergistic action of the additives may cause the electrodeposits to show in tensile orcompression stress. The internal stress of the deposits was quite changable at the beginningof the electrodeposition and gradually turned to be stable later on.
出处
《电镀与涂饰》
CAS
CSCD
1998年第1期6-10,共5页
Electroplating & Finishing
关键词
钯
电沉积层
氢含量
内应力
助剂
镀层
电镀
palladium, electrodeposition, hydrogen content, stress, additive
