摘要
面对芯片封装领域对高速、高精度平台的需求,设计了一种高速键合机精密工作台。工作台X,Y,Z向采用直线音圈电机直接驱动。运用有限元分析与机械系统动态仿真相结合的方法,建立工作台的仿真模型,运用虚拟样机技术对工作台弹性解耦机构中的关键部件—弹簧进行动态优化设计,分析了弹簧刚度与预载的匹配关系,探讨了铰链弹性对键合机工作台动态性能的影响作用。对工作台的工作过程进行了仿真分析。在此基础上制作了样机。实验结果表明:该精密工作台性能指标达到设计要求,验证了设计方法的正确性。
For satisfying the requirement of the high speed and precision table in the chip packaging application, a high speed wire bonder precision positioning table was designed. The table was driven directly by linear and rotational voice coil actuator in the direction of X, Y and Z separately. By use of the FEA anddynamic simulation method, the simulating model of positioning table was set up, and the spring as the key component in the decoupling mechanism of positioning table was optimized by using virtual prototyping technology. The matching correlation of the spring stiffness and preload of the decoupling mechanism was analyzed, and the influence of elasticity of the flexible hinge for the wire bonder precision positioning table capability was discussed in detail The operating process of positioning table was simulated. The prototype of positioning table was fabricated. Experimental results indicate that the positioning table capability achieved design parameters; design method correctness is also proved.
出处
《系统仿真学报》
CAS
CSCD
北大核心
2009年第10期2895-2899,共5页
Journal of System Simulation
基金
国家自然科学基金(50505032)
关键词
键合机
弹性机构
建模
虚拟样机
仿真分析
实验
wire bonder
flexible mechanism
modeling
virtual prototyping
simulation analysis
experiment
