摘要
从ＰＣＢ设计，漏印模板设计与制造，焊膏应用以及组装工艺等方面，讨论了细间距ＳＭＴ工艺技术，提出相应的对策，这对提高细间距器件的焊接质量具有普遍意义。
Fine Pitch Technolgy is discussed from PCB design,the design and manufacture of stencil,the application of solaer paste and assembly process.In this paper,appropriate measures are suggested, these measures are of general importance to improve the solder quality of FPD.
出处
《电子工艺技术》
1998年第2期51-53,共3页
Electronics Process Technology
关键词
SMT
细间距器件
模板
焊盘
焊膏
SMT Fine pitch device Stencil Solder pad Solder paste
