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SnAgCuY钎料表面Sn晶须的旋转生长现象 被引量：4

Rotational growing phenomena of Sn whiskers on SnAgCuY solder surface
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摘要 研究了Sn3.8Ag0.7Cu1.0Y钎料表层上YSn3稀土相表面Sn晶须的生长行为。结果表明:室温时效条件下在YSn3的表面会出现Sn晶须的快速生长现象,生长速度最快可达10–10m/s,长度最长可达200μm。YSn3稀土相氧化的不均匀性是导致Sn晶须在生长时产生各种旋转现象的主要原因。 Researched the Sn whiskers growth behavior was on the surface of YSn3RE-phase on Sn3.8Ag0.7Cu1.0Y solder. Results show that there appears rapid growth of tin whiskers with growth rate up to 10^-10m/s and length up to 200 um on the surface of YSn3RE-phase under room-temperature aging. YSn3RE-phase unequal oxidation is main reason to result in rotational phenomena of Sn whisker growing.
作者 郝虎 李广东 史耀武 夏志东 雷永平
机构地区 北京工业大学材料科学与工程学院
出处 《电子元件与材料》 CAS CSCD 北大核心 2008年第11期54-56,共3页 Electronic Components And Materials
基金 "十一五"国家科技支撑重点资助项目(No.2006BAE03B02)
关键词 金属材料 SN晶须 无铅钎料 SnAgCuY钎料 metallic material Sn whiskers lead-free solder SnAgCuY solder
分类号 TN406 [电子电信—微电子学与固体电子学]
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二级参考文献11

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共引文献26

同被引文献17

  • 1郝虎,田君,史耀武,雷永平,夏志东.SnAgCuY系稀土无铅钎料显微组织与性能研究[J].稀有金属材料与工程,2006,35(A02):121-123. 被引量：27
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电子元件与材料
2008年 第11期

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