摘要
研究了温度和水煮时间对五种偶联剂处理前后的玻璃纤维／环氧树脂基复合材料界面层介电性能的影响。结果表明，温度和水煮时间对其复合界面层的介电性能均有强烈的影响。
Influence of temperature and boiling time on the dielectrical property of glass fiber (before and after the glass fiber is treated with five kinds of coupling agents) / epoxy resin matrix composite interface was studied. The results show that there is a strong effect of temperature and boiling time on the dielectrical property of glass fiber/epoxy matrix composite interface, and that its improvement range depends on the polarization intensity of the interface.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
1997年第3期67-71,共5页
Acta Materiae Compositae Sinica
关键词
界面层
复合材料
温度
介电性能
玻璃纤维
interface layer, composite, coupling agent, wetting, temperature, boiling time, dielectrical property
