摘要
本文针对一种陶瓷粉填充、玻璃短纤维增强的聚四氟乙烯高频介质材料，制造通讯用多层微波印制电路板进行了简单的介绍，此外，选用GORE公司生产的SPEEDBOARD C半固化片材料，进行微波多层印制板层压制造的工艺技术进行了较为详细的介绍。
The fabrication of the microwave multilayer printed circuit board of the glass microfiber reinforced polytetrafluoetylene with ceramic particles filled composite applied for communication was briefly introduced. Besides, the press technology of the microwave multilayer printed circuit board using SPEEDBOARD C prepreg from GORE was detailed introduced.
出处
《电子电路与贴装》
2008年第1期19-25,共7页
Electronics Circuit & SMT
