摘要
传感器系统微小型化的发展趋势是将各功能模块进行三维模块化集成。本研究将加速度计芯片及调制解调电路进行三层堆叠模块集成。其中,各层模块的组装采用了FR4基板上的COB工艺,而垂直互连采用了一种新型的垂直定位装置进行定位和回流焊,实现了加速度计和调制解调电路的三维堆叠模块化封装结构。该结构成功把MEMS器件与IC芯片混合集成在同一模块里;采用了一种新的定位销/孔的定位方式,可同时进行3×3个模块的高精度堆叠定位（其对位误差约0.068mm）;通过丝网印刷焊膏,一次回流焊接完成堆叠模块的垂直互连,互连强度高（单个焊点平均强度为30-40MPa）;封装体积小（整个加速度计调制解调系统封装后的体积为19×19×8mm^3）。还讨论了垂直互连的影响因素。对模块进行的剪切力测试表明采用印刷焊膏回流实现垂直互连的强度满足相关标准。
Integrating multi-functional modules into a 3D module is a trend of MEMS miniaturization.A 3D stacked modular package structure of an accelerometer and its modem circuit is fabricated in this article.According to the requirements of modular package,three layers of the stacked module are designed and fabricated on the basis of an accelerometer and its modem circuit.The COB technology based on FR4 substrate is used to assemble devices onto modules,then by being printed through stencil,passive devices attaching,aligning by a novel alignment tool of vertical interconnection and reflowing,a 3D stacked modular package structure of an accelerometer and its modem circuit is successfully manufactured.MEMS and IC devices are assembled in the same module,high precision（the alignment error is about 0.068mm） stacked alignment of 3×3 modules is complete by the method of alignment bar/via,The vertical interconnection of the stacked module is achieved by being printed through stencil and reflowing once,the average strength of a solder joint is between 30MPa～40MPa,the volume of entire stacked module is about 19×19×8mm^3.Factors influencing the vertical interconnection are discussed and shear strength test of the module is presented.
出处
《功能材料与器件学报》
CAS
CSCD
北大核心
2008年第3期675-681,共7页
Journal of Functional Materials and Devices
关键词
三维堆叠模块
定位装置
回流
垂直互连
3D stacked module
alignment tool
reflow
vertical interconnection
