摘要
以N2、O2作载气,采用催化增强化学气相沉积（CECVD）法,于250～300℃和减压/常压下制得沉积于聚酰亚胺（PI）上的Pt,Pd/Pt和Pt/Pd金属双层薄膜。当使用Pd（hfac）2和Pt（COD）Me2为前驱体,在同一反应器内共沉积时只有Pt被沉积（钯配合物起催化剂作用）,金属铂、钯顺序沉积可形成双层膜。经XPS和SEM分析了所得沉积膜的表面结构与相组成。结果表明：所有沉积层与PI衬底的粘附性能良好;沉积速率为70～80nm/h,钯、铂粒径分别为100nm和100～150nm。
Pd/Pt and Pt/Pd bilayer films on polyimide are prepared by catalyst-enhanced chemical vapor deposition （CECVD） in the carrier gases of N2, O2 at 250～300 ℃under a reduced pressure and a normal pressure. With the enhancement of palladium complex, the platinum is deposited by mixing the precursor platinum complex Pt（COD）Me2 and palladium complex catalyst Pd（hfac）2 in the same chamber. Sequential deposition of Pd and Pt metals are used for deposition of Pd/Pt and Pt/Pd bilayer films. These metal films are characterized by XPS and SEM, showing good adhesive properties with polyimide substrates. The deposition rate is 70～80 nm/h, and the particle sizes of Pd and Pt are in region of 100 nm and 100～150 nm, respectively. The CECVD mechanism of platinum is presumed.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2008年第5期918-921,共4页
Rare Metal Materials and Engineering
基金
国家自然科学基金(40172018,20675033)
关键词
聚酰亚胺
催化增强化学气相沉积
铂薄膜
钯-铂双层膜
表征
polyimide （PI）
catalyst-enhanced chemical vapor deposition （CECVD）
platinum film
palladium-platinum bilayers
characterization
