摘要
采用粉末冶金法制备了不同含量的纳米SiC和SiO2颗粒增强的Cu基复合材料．研究了增强相含量对铜基复合材料性能的影响，比较了n-SiC和n-SiO2对铜的增强效果。结果表明，n-SiO2和n-SiC颗粒较少含量较少时在基体中分布较为均匀，团聚较少；随着复合材料中n-SiC和n-SiO2质量分数的增加，材料的密度降低，电阻率升高，而硬度先升高后降低；两种复合材料的软化温度都达到700℃以上，远远高于纯铜的软化温度（15012），提高了材料的热稳定性；颗粒含量相同时，n-SiC的对铜基体的增强效果要优于n-SiO2。
Two kinds of Cu/SiC and Cu/SiO2composites were fabricated by powder metallurgy method. The influence of reinforcement particles contents on the relevant properties of composites and the microstructure of Cu/SiC and Cu/SiO2 composites was studied. The reinforcement effects of nano-SiC and nano-SiO2 particles were compared. In addition, the results show that with the increase in the amount of nano-SiC and nano-SiO2 particles, the density of the both composites decreases, the resistivity increases, whereas the hardness increases firstly then drops. The softening temperatures of the two kinds of composites are above 700℃, which is far higher than that of the pure copper, leading to the improvement of the thermal stability of the composites at high temperatures. Considering all factors, the reinforcement effect of nano-SiC is better than that of nano-SiO2, when their contents are the same in the copper matrix.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2007年第A02期511-513,共3页
Journal of Functional Materials
基金
安徽省自然科学基金资助项目（070414180）
安徽省“十五”二期科技攻关资助项目（040020392）
合肥市重点科技攻关资助项目（20051044）.
关键词
CU基复合材料
粉末冶金
纳米颗粒
热稳
定性
copper matrix composite
powder metallurgy
nano-particle
thermal stability
