摘要
对乙二胺镀铜工艺进行了研究,讨论了Cu^(2+)浓度、pH值、温度、电流密度等因素对电镀铜效果的影响。主要依据镀层外观和一定时间内镀层厚度,确定了本实验的最佳工艺条件:硫酸铜(CuSO_4·5H_2O)100g/L,乙二胺(C_2N_2H_8)50～68g/L,硝酸钾(KNO_3)3～4g/L,电解液pH值8～9,温度50～60℃,阴极电流密度3～4.5 A/dm^2。
The process of copper electroplating with ethylenediamine was studied. The influences of Cu^2＋ concentration, pH, temperature, and current density on the effect of copper electroplating were discussed. The optimum conditions were determined according to the appearance and thickness of the electroplating layer, which were as follows： CuSO4- 5 H2O 100 g/L, C2 N2Ha 50 - 68 g/L, KNO3 3 - 4 g/L, pH 8 - 9, temperature 50 - 60℃, cathodal current density 3 - 4.5 A/dm2.
出处
《精细石油化工进展》
CAS
2007年第10期31-33,共3页
Advances in Fine Petrochemicals
关键词
镀铜
乙二胺
镀铜电解液
copper electroplating, ethylenediamine, electrolyte
