摘要
采用氯化银比浊法 ,在不分离硫酸铜的条件下 ,直接测定镀铜电解液中微量氯离子。对试验条件和可能存在的干扰进行了研究 ,样品的加标回收率在 98.7%～ 1 0 7.0 %之间 ,相对标准偏差在 2 .7%～ 8.8%之间。方法快速简单 ,结果满意。
It is reported in this paper that microamounts of chloride in copper electroplating solution can be determined directly by the turbidimetric method (as AgCl) in the presence of the major component, Cu 2+ ion. The optimum conditions and interferences of the determination are also studied. The recoveries of the method are found to be in the range 98.7%~107.0% with RSD between 2.7%~8.8%. The method is simple and rapid.
出处
《理化检验（化学分册）》
CAS
CSCD
北大核心
2000年第6期257-258,260,共3页
Physical Testing and Chemical Analysis(Part B:Chemical Analysis)
关键词
氯
氯化银比浊法
电镀液
铜箔
微量分析
Chloride ion Silver chloride Turbidimetry Electroplating solution Copper foil
