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压延铜箔电镀Zn-Ni合金工艺研究 被引量:5

Study on Zinc-Nickel Alloy Electroplating Process of Wrought Rolled Copper Foil
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摘要 研究了硫酸盐-柠檬酸体系电镀锌-镍合金工艺。该锌-镍合金作为印制板用压延铜箔的阻挡层。考察了镀液主要成分及工艺条件对压延铜箔性能的影响,并对各因素进行分析,由此确定了压延铜箔电镀锌-镍合金工艺条件。经测试,使用该工艺处理的压延铜箔与印制板基板具有良好的结合力,并具有较强的耐腐蚀性。 A new process of zinc-nickel alloy plating in system of sulfate and citric acid was studled. The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing. The influences of the main components of the plating bath and the technical parameters on the performances of the rolled copper foil were researched. And thus the zinc-nickel plating technical conditions were defined. The rolled copper foil treated by the process was tested. The results show that the corrosion resistance of and the adhesion between the treated rolled copper foil and the substrate are improved.
出处 《电镀与精饰》 CAS 2007年第6期16-19,共4页 Plating & Finishing
基金 上海市教委科研基金资助项目(2006AZ004)
关键词 印制板 压延铜箔 结合力 电镀锌-镍合金 printed circuit board wrought rolled copper foil adhesion zinc-nickel electroplating
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