摘要
热应力分析在微电子封装的设计和制造中是非常重要的一环。影响微电子封装可靠性的因素包括封装结构中的温度分布、热致变形和关键界面上的层间粘结强度。在微电子封装热应力分析和可靠性评估中,实验力学起着重要的作用。凭借其内在的并行处理能力,实验力学中的光学方法可以提供现场的、具有各种敏感度和解析度的全场位移测量,因而它也被广泛地用于微电子封装领域。本文讨论了光学方法在微电子封装热应力分析中的应用,并举实例来说明光学方法是如何地被用于微电子封装技术的研发以及考核验收。
Thermo-mechanical analysis is very important in the design and manufacturing of microelectronics package. The main concerns in packaging reliability include temperature distributions, thermally induced deformations and interracial adhesion at the critical interfaces of the microelectronics packages. Experimental mechanics plays an important role in packaging thermo-mechanical analysis and reliability assessment. With their inherent parallel processing capability, the optical methods used in experimental mechanics can offer in-situ and whole-field displacement measurement with various sensitivities and resolutions for the microelectronics packaging applications. In this paper, discussions are given on applications of advanced optical techniques for the thermo-mechanical analysis of microelectronics packages. Examples are used to demonstrate the real world applications of these optical methods in the development and qualification of advanced packages.
出处
《实验力学》
CSCD
北大核心
2007年第3期236-248,共13页
Journal of Experimental Mechanics
关键词
微电子封装
光学方法
云纹干涉
阴影云纹
显微热成像
microelectronics packaging
optical methods
moiré interferometry
shadow moiré；micro-thermal Imaging
