摘要
利用显微硬度计测定、分析了含1.55%铜高纯钢在550,650℃不同时效时间时的硬度,应用金相显微镜(ZEISS)、X射线衍射仪和JEM-2010型高分辨电子显微镜观察了含铜高纯钢等温时效过程的显微组织与结构,分析了等温时效工艺与硬度、显微组织之间的关系.结果表明,时效温度越高,达到硬度峰值所需的时间越短,且峰值硬度降低;550℃过时效阶段,铁索体晶粒中分布着大量的颗粒状铜原子富集区,颗粒尺寸约20~72 nm,随着等温时效时间的延长,富铜析出物不断粗化长大,从而导致硬度下降.
Microhardness of high purity steel bearing 1.55-Cu during aging treatment at 550 ℃ and 650 ℃ was tested and then analyzed by microhardness tester. The microstructure of high purity steel bearing copper during isothermal aging treatment was observed by means of ZEISS metallographic microscope, X-ray diffractometer and JEM-2010 HREM. The relations of isothermal .aging process to microhardness and microstructure were analyzed. The result showed that the holding time arriving at aging peak was shorter and the aging peak hardness was lower with increasing the aging temperature. There were a large number of Cu-rich clusters distributed in the ferrite matrix whose size was about 20 - 72 nm in the over-aging process of aging treatment at 550 ℃ . The rich-copper particles were coarsened with prolonging the holding time, thus leading to the decrease in micro-hardness.
出处
《内蒙古科技大学学报》
CAS
2007年第1期14-18,共5页
Journal of Inner Mongolia University of Science and Technology
基金
国家自然科学基金资助项目(50361001)
关键词
含铜高纯钢
固溶
时效硬化
析出
high purity steel beating copper
solution
age-hardening
precipitation