摘要
利用微槽群蒸发型热沉技术设计了一种新颖的用于电子芯片散热的微槽群蒸发器, 对影响微槽群蒸发器散热性能的各种因素进行了实验研究. 实验结果表明, 采用适当的真空度和液容率, 可以提高微槽群蒸发器的散热效果. 通过与主流的奔腾4 CPU芯片风冷散热器的散热性能比较发现, 在低于芯片许容上限温度 (100 ℃)的范围内, 微槽群蒸发器具有更高的散热热流密度; 微槽群蒸发器更适用于具有高发热热通量和热敏性强的高性能电子芯片的冷却.
A novel micro capillary groove evaporator for electronic chip cooling by using the micro capillary groove heat sink technique was designed, and an experimental investigation on the influence of various factors on cooling performance of the evaporator was carried out. The experimental results showed that an appropriate vacuum degree and volume fraction of liquid should be chosen for maximizing the cooling capacity of the evaporator. Compared with a current fan-cooled radiator for CPU chip of Pentium 4, the micro capillary groove evaporator showed higher capacity when keeping the chip temperature below 100°C. It was suitable for cooling those electronic chips with high power and thermal sensitivity.
出处
《化工学报》
EI
CAS
CSCD
北大核心
2005年第3期412-416,共5页
CIESC Journal
基金
中国科学院"百人计划"项目
中国科学院知识创新工程重要方向性项目.~~
关键词
电子芯片
微槽群蒸发器
液容率
风冷散热器
Heat transfer
Radiators
Refrigerants
Schematic diagrams
Volume fraction
