摘要
介绍了国内外常用的 IC 用引线框架材料的性能及研究现状,并对其发展前景进行了展望。
In this paper, the study status and properties of the common copper alloys at home and abroad used for leading frame of integrated circuit are introduced, and the development directions of lead frame materials are prospected.
出处
《有色金属加工》
CAS
2007年第2期15-16,共2页
Nonferrous Metals Processing
关键词
集成电路
铜合金
引线框架
integrated circuit
copper alloy
leading frame
